Semiconductor device and programming method

ABSTRACT

The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.

CROSS-REFERENCES TO RELATED APPLICATIONS

This is a continuation-in-part of International Application No.PCT/JP2006/300543, filed Jan. 17, 2006 which was not published inEnglish under PCT Article 21(2).

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates generally to semiconductors and fabricationmethods therefor, and more particularly, to a semiconductor devicehaving a resin sealing portion and a fabrication method therefor.

2. Description of the Related Art

In recent years, there is a need for reducing the size of semiconductordevices for use in non-volatile memory media or the like of portableelectronic devices such as, for example, mobile telephones, and ICmemory cards. In order to achieve this need, packages of thesemiconductor devices have to be thinner.

Japanese Patent Application Publication No. 8-153832 discloses atechnique of forming a resin sealing portion by use of a sheet-shapedresin.

FIG. 1A and FIG. 1B are views illustrating problems posed by theconventional example. Referring to FIG. 1A, semiconductor chips 22 and24 are stacked and mounted on a wiring substrate 10 of a glass epoxysubstrate or the like serving as a chip mounting portion. Thesemiconductor chips 22 and 24 are electrically coupled to pads 16 of thewiring substrate 10 by means of wires 26 and 28. The semiconductor chips22 and 24 are resin-sealed by a resin sealing portion 30 of epoxy resinor the like. Land electrodes 12 are provided at a surface of the wiringsubstrate 10 opposite to another surface on which the semiconductorchips 22 and 24 are mounted, and solder balls 14 are provided at theland electrodes 12. There are also provided in the wiring substrate 10,wires for connecting the pads 16 and coupling portions that couple thepads 16 and the electrodes 12, however, a detailed description will beomitted here.

A distance H between the surface of the semiconductor chip 24 and thetop surface of the resin sealing portion 30 is reduced to make thepackage of the semiconductor device thinner. If so, it will be difficultto fill the resin for sealing between the die that molds the resinsealing portion 30 and the top surface of the semiconductor chip 24 atthe time of forming the resin sealing portion 30. This results in thegeneration of an unfilled portion 90 where the resin is not filled, atthe top portion of the semiconductor chip 24. Also, if the distance H isreduced, a filler at the surface of the resin sealing portion 30 will beeasily removed, thereby forming a removed portion 91 from which thefiller is removed. At the time of printing a mark on the top surface ofthe resin sealing portion 30, the semiconductor chip 24 will be damagedby laser at the unfilled portion 90 or the removed portion 91. Inaddition, as indicated by dotted circles 92, the wires 28 may be exposedfrom the resin sealing portion 30. Therefore, it is difficult to reducethe distance H.

FIG. 1B is a view illustrating the problem of the semiconductor devicewith the technique disclosed in Japanese Patent Application PublicationNo. 8-153832. Semiconductor chips 22, 23, and 24 are stacked and mountedon the wiring substrate 10. The semiconductor chips 22, 23, and 24 aresealed by the resin sealing portion 30. Other configurations in FIG. 1Bare same as those in FIG. 1A, and a detailed explanation will be omittedhere. The resin sealing portion 30 is formed by arranging a sheet-shapedresin on the mold and then providing the semiconductor chips 22, 23, and24 and the wiring substrate 10 on the sheet-shaped resin. In such case,since the sheet-shaped resin is interposed between the semiconductorchip 24 and the die, no unfilled portion will be generated on thesemiconductor chip 24. However, the viscosity of the resin cannot belowered at the time of forming the resin sealing portion 30 to avoid theexposure of the wire 28. This will produce an unfilled portion 94 wherethe resin is not filled at a small portion where one semiconductor chipoverhangs another, for example, the semiconductor chip 24 overhangs thesemiconductor chip 23. Also, the filler has to be additionally providedto the resin sealing portion 30 to maintain the strength of the wholeresin sealing portion 30. This cannot prevent the removal of the filler.

SUMMARY OF THE INVENTION

The present invention has been made in view of the above circumstancesand provides a semiconductor device and a fabrication method therefor,by which it is possible to reduce the size of the package and to preventthe generation of a resin-unfilled portion in a resin sealing portion ora filler-removed portion or to prevent the exposure of wire from theresin sealing portion.

According to a first aspect of the present invention, there is provideda method for fabricating a semiconductor device including: mounting asemiconductor chip on a chip mounting portion; disposing a sheet-shapedresin at a side of the semiconductor chip opposite to the chip mountingportion; and forming a resin sealing portion between the sheet-shapedresin and the chip mounting portion, to seal the semiconductor chip. Itis possible to prevent the generation of a resin-unfilled portion at asurface of the semiconductor chip.

According to a second aspect of the present invention, there is provideda semiconductor device including: a semiconductor chip; a chip mountingportion mounting the semiconductor chip; a sheet-shaped resin portionprovided at a side of the semiconductor chip opposite to the chipmounting portion; and a resin sealing portion provided between thesheet-shaped resin and the chip mounting portion, to seal thesemiconductor chip. It is possible to prevent the generation of theresin-unfilled portion.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A and FIG. 1B are views illustrating the problem of asemiconductor device of a conventional example;

FIG. 2A and FIG. 2B are (first) views illustrating a fabrication methodof a semiconductor device in accordance with a first embodiment of thepresent invention;

FIG. 3A and FIG. 3B are (second) views illustrating the fabricationmethod of the semiconductor device in accordance with the firstembodiment of the present invention;

FIG. 4 is a cross-sectional view of the semiconductor device inaccordance with the first embodiment of the present invention;

FIG. 5A and FIG. 5B are (first) views illustrating a fabrication methodof a semiconductor device in accordance with a second embodiment of thepresent invention;

FIG. 6A and FIG. 6B are (second) views illustrating the fabricationmethod of the semiconductor device in accordance with the secondembodiment of the present invention;

FIG. 7 is a cross-sectional view of the semiconductor device inaccordance with the second embodiment of the present invention;

FIG. 8 is a cross-sectional view of the semiconductor device inaccordance with a third embodiment of the present invention;

FIG. 9 is a cross-sectional view of the semiconductor device inaccordance with a fourth embodiment of the present invention;

FIG. 10 is a cross-sectional view of the semiconductor device inaccordance with a fifth embodiment of the present invention;

FIG. 11 is a (first) cross-sectional view of the semiconductor device inaccordance with a sixth embodiment of the present invention; and

FIG. 12 is a (second) cross-sectional view of the semiconductor devicein accordance with the sixth embodiment of the present invention.

FIG. 13 illustrates a block diagram of a conventional portable phone,upon which embodiments may be implemented.

FIG. 14 illustrates a block diagram of a computing device, upon whichembodiments may be implemented.

FIG. 15 illustrates an exemplary portable multimedia device, or mediaplayer, in accordance with various embodiments of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A description will now be provided, with reference to the accompanyingdrawings, of embodiments of the present invention.

First Embodiment

A first embodiment is an example in which a wiring substrate 10 is usedas a chip mounting portion, and a resin sealing portion 30 is formed byvacuum dipping molding. A description will be given, with reference toFIG. 2A through FIG. 3B, of a fabrication method of a semiconductordevice in accordance with a first embodiment of the present invention.Referring to FIG. 2A, there are arranged: an upper die 40 to resin-sealsemiconductor chips 22 and 24; and a lower die 44 fit in a frame portion42. A cavity 46 is defined at an upper portion of the lower die 44inside the frame portion 42 to form a resin sealing portion. The bottomsurface of the cavity 46 corresponds to the top surface of the lower die44.

Referring to FIG. 2B, the semiconductor chips 22 and 24 having athickness of approximately 100 μm are sequentially mounted on the wiringsubstrate 10. The semiconductor chips 22 and 24 are electrically coupledto pads 16 provided on the wiring substrate 10 by wires 26 and 28respectively. In this manner, there is formed a sealed substrate 20 inwhich the semiconductor chips 22 and 24 are mounted on the wiringsubstrate 10. The sealed substrate 20 is arranged on a surface of theupper die 40, the surface opposing the lower die 44. A sheet-shapedresin 33 a having a thickness of approximately 50 μm is disposed at thebottom surface of the cavity 46, the bottom surface corresponding to thesurface of the lower die 44 that opposes the upper die 40. That is tosay, the sheet-shaped resin 33 a is arranged at a side of thesemiconductor chip 24 mounted above the wiring substrate 10 opposite tothe wiring substrate 10. In other words, the sheet-shaped resin 33 a isdisposed on a top surface 43 opposed by the semiconductor chip 24 of thelower die 44 that seals the semiconductor chips 22 and 24 with resin.The sheet-shaped resin 33 a may be, for example, a thermosetting epoxyresin, and may be provided, for example, in an uncured state. Inaddition, no filler is added to the sheet-shaped resin 33 a.

Referring to FIG. 3A, an uncured resin 31 of, for example, thethermosetting epoxy resin having a shape of powder, granule, or tabletis disposed on the sheet-shaped resin 33 a and at the bottom surface ofthe cavity 46. That is, the uncured resin 31 for resin-sealing isarranged between the sheet-shaped resin 33 a and the semiconductor chip24. In one embodiment, filler with the average gain diameter ofapproximately 75 μm is added to the uncured resin 31.

Referring to FIG. 3B, the upper die 40 and the frame portion 42 are puttogether, and the lower die 44 is moved to the upper portion in theframe 42 at, for example, approximately 175° C. The uncured resin 31 iscompressed at high temperature and the compression molding is performed.Here, the sheet-shaped resin 33 a is configured to have a higherviscosity than that of the uncured resin 31. By performing theabove-described compression molding, the uncured sheet-shaped resin 33 abecomes hardened, and a sheet-shaped resin portion 32 a is formed. Inaddition, a resin sealing portion 30 a is formed by the uncured resin31, which is different from the sheet-shaped resin 33 a, between thewiring substrate 10 and the sheet-shaped resin 33 a. That is, theuncured resin 31 seals the semiconductor chips 22 and 24. Then, thesealed substrate 20 is removed from the dies 40 and 44, and solder balls14, not shown, are formed at a surface of the wiring substrate 10opposite to another surface on which the semiconductor chips 22 and 24are mounted.

FIG. 4 is a cross-sectional view of the semiconductor device inaccordance with the first embodiment of the present invention. Referringto FIG. 4, unlike the configurations of FIG. 1A and FIG. 1B, there areprovided the sheet-shaped resin portion 32 a at a side of thesemiconductor chip 24 opposite to the wiring substrate 10; and the resinsealing portion 30 a interposed between the sheet-shaped resin portion32 a and the wiring substrate 10 and sealing the semiconductor chips 22and 24. In one embodiment, the sheet-shaped resin portion 32 a isapproximately 50 μm in thickness, and the resin sealing portion 30 a,interposed between the sheet-shaped resin portion 32 a and the wiringsubstrate 10, is approximately 50 μm in thickness. Also, the wires 28are in contact with the sheet-shaped resin portion 32 a. Otherconfigurations are same as those shown in FIG. 1A and FIG. 1B, the sameconfigurations have the same reference numerals, and a detailedexplanation will be omitted. In one embodiment, the sheet-shaped resinportion 32 a is 10-100 Mm in thickness.

According to the first embodiment of the present invention, thesheet-shaped resin 33 a is disposed at a side of the semiconductor chip24 opposite to the wiring substrate 10, and the sheet-shaped resinportion 32 a is formed, as shown in FIG. 2B. The resin sealing portion30 a that seals the semiconductor chips 22 and 24 is formed between thesheet-shaped resin 33 a and the wiring substrate 10, as shown in FIG.3B. In this manner, the resin sealing portion 30 a is formed with thesheet-shaped resin 33 a disposed on the surface of the semiconductorchip 24. Hence, it is possible to prevent the generation of aresin-unfilled portion at the surface of the semiconductor chip 24.

In addition, as shown in FIG. 2B, the sheet-shaped resin portion 32 a isdisposed on a surface of the lower die 44, the surface opposing thesemiconductor chip 24, thereby forming the sheet-shaped resin portion 32a on the surface of the semiconductor chip 24.

Furthermore, as shown in FIG. 3A, the uncured resin 31 for resin sealingis disposed and interposed between the sheet-shaped resin 33 a and thesemiconductor chip 24, to resin-seal the semiconductor chip 24. Thismakes it possible to provide the resin sealing portion 30 a partiallybetween the sheet-shaped resin portion 32 a and the semiconductor chip24. Therefore, it is possible to prevent the generation of theresin-unfilled portion.

Furthermore, the sheet-shaped resin 33 a disposed in FIG. 2B is a resinto which the filler is not added. Hence, the sheet-shaped resin portion32 a in FIG. 4 is a resin that does not include the filler. This makesit possible to prevent the generation of the filler removed portion,unlike FIG. 1A. Also, the strength of the resin portion can bemaintained by adding the filler to the resin sealing portion 30 a.

Furthermore, the higher viscosity of the sheet-shaped resin 33 a canprevent the wires 28 from being embedded in the sheet-shaped resin 33 aduring the molding process. Accordingly, the wires 28 are formed incontact with the sheet-shaped resin portion 32 a. This makes it possibleto prevent the exposure of the wires 28 from the resin portion.

Second Embodiment

A second embodiment is an example in which the wiring substrate 10 isused as a chip mounting portion and a resin sealing portion 30 b isformed by transfer molding. A description will be given, with referenceto FIG. 5A through FIG. 6B, of a fabrication method of a semiconductordevice in accordance with a second embodiment of the present invention.Referring to FIG. 5A, there are arranged an upper die 54 and a lower die50 to resin-seal the semiconductor chips 22 and 24. A depression portion57 is defined in the lower die 50 to dispose the sealed substrate 20,and a cavity 56 is defined in the upper die 54 to mold the resin sealingportion 30 b. In addition, a storing portion 59 is provided in the lowerdie 50, and an injection path 58 is provided in the upper die 54 toguide resin to the cavity 56.

Referring to FIG. 5B, the sealed substrate 20 is disposed in thedepression portion 57. The configuration of the sealed substrate 20 issame as that employed in the first embodiment, the same configurationshave the same reference numerals, and a detailed explanation will beomitted. A sheet-shaped resin 33 b is disposed on the top surface of thecavity 56 in the upper die 54. In one embodiment, the sheet-shaped resin33 b has a thickness of approximately 100 μm. That is, the sheet-shapedresin 33 b is arranged at a side of the semiconductor chip 24 mountedabove the wiring substrate 10, opposite to the wiring substrate 10. Inother words, the sheet-shaped resin 33 b is disposed on a surface 53 ofthe upper die 54 for resin sealing the semiconductor chips 22 and 24,the surface 53 opposing the semiconductor chip 24. The sheet-shapedresin 33 b is a thermosetting epoxy resin without a filler, and isprovided in an uncured state. An uncured resin 60 is disposed in thestoring portion 59 of the lower die 50. The uncured resin is athermosetting epoxy resin that includes a filler, as described abovewith respect to FIGS. 2A-4.

Referring to FIG. 6A, the upper die 54 and the lower die 50 are puttogether, and are heated at, for example, 175° C. Here, the sheet-shapedresin 33 b is lower in viscosity than the sheet-shaped resin 33 adescribed above, and the wires 28 are at least partially embedded in thesheet-shaped resin 33 b. The sheet-shaped resin 33 b is arranged incontact with the semiconductor chip 24. Referring to FIG. 6B, by guidingan inserting portion 62 to the storing portion 59, the uncured resin 60is passed through the injection path 58 and injected between thesheet-shaped resin 33 b and the sealed substrate 20. In the abovemanner, the uncured sheet-shaped resin 33 b is hardened into asheet-shaped resin portion 32 b. Also, the uncured resin 60 is injectedbetween the wiring substrate 10 and the sheet-shaped resin 33 b, thesemiconductor chips 22 and 24 are sealed, and the resin sealing portion30 b is molded. That is, the uncured resin 60 seals the semiconductorchips 22 and 24. In addition, the upper die 54 and the lower die 50 arearranged vice versa to arrange the sealed substrate 20 in the lower dieand the sheet-shaped resin 33 b in the upper die. Then, the sealedsubstrate 20 is removed from the dies 50 and 54, and the solder balls14, not shown, are formed at a surface of the wiring substrate 10opposite to another surface on which the semiconductor chips 22 and 24are mounted.

FIG. 7 is a cross-sectional view of the semiconductor device inaccordance with the second embodiment of the present invention.Referring to FIG. 7, unlike the configuration of FIG. 4, the wires 28are embedded in the sheet-shaped resin portion 32 b, and thesheet-shaped resin portion 32 b is provided in contact with thesemiconductor chip 24. Other configurations are same as those in FIG. 4,the same configurations have the same reference numerals, and a detailedexplanation will be omitted. In addition, the thickness of thesheet-shaped resin portion 32 b is approximately falls in the range of10 to 150 μm on thickness in accordance with one embodiment. Preferably,this thickness is about 100 μm.

When the resin sealing is performed by transfer molding, the uncuredresin 60 is demanded to be injected between the semiconductor chip 24and the upper die 54 to make the package thinner. This may easilygenerate a resin-unfilled portion. Hence, as shown in FIG. 6A and FIG.6B, the semiconductor chips 22 and 24 are sealed with resin so that thesheet-shaped resin 33 b may be brought into contact with thesemiconductor chip 24. That is, the sheet-shaped resin portion 32 b isprovided in contact with the semiconductor chip 24. Also, the wires 28are at least partially embedded in the sheet-shaped resin portion 32 b.This makes it possible to prevent the generation of the resin-unfilledportion between the semiconductor chip 24 and the sheet-shaped resin 33b, even in the case of sealing with resin by transfer molding.

In accordance with the first and second embodiments, the semiconductorchips 22 and 24 are stacked semiconductor chips. When the semiconductorchips are stacked and the package thereof is to be made thinner, theresin portion on the semiconductor chip 24 becomes thinner, and, inparticular, the resin-unfilled portion or the filler removed portion maybe easily produced and the wire may be easily exposed. Accordingly, theeffects of the present invention can be further brought, by applying thepresent invention to the above-described circumstance.

Third Embodiment

A third embodiment is an example in which a resin sealing portion 30 cis also provided between a sheet-shaped resin portion 32 c and thesemiconductor chip 24, and the wires 28 are embedded in the sheet-shapedresin portion 32 c. When the vacuum dipping molding is employed as inthe first embodiment, the wires 28 can be embedded in the sheet-shapedresin portion 32 c. This makes it possible to make the package thinnerthan that employed in the first embodiment.

Fourth Embodiment

A fourth embodiment is an embodiment in which a lead frame 70 isemployed as a chip mounting portion. Referring to FIG. 9, the lead frame70 includes a lead 72 and a mounting portion 71. A semiconductor chip 74is mounted on the mounting portion 71. A sheet-shaped resin portion 82is provided at a side of the semiconductor chip 74 opposite to themounting portion 71. A portion of the lead 72, the mounting portion 71,and the semiconductor chip 74 are sealed by a resin sealing portion 80.The resin sealing portion 80 is arranged between the sheet-shaped resinportion 82 and the mounting portion 71, and the semiconductor chip 74 issealed by resin. In this manner, even when the semiconductor chip 74 ismounted on the lead frame 70, the sheet-shaped resin portion 82 may beprovided. This makes it possible to prevent the generation of theresin-unfilled portion or the exposure of the wire.

Fifth Embodiment

In the package having the lead frame 70 therein, the resin sealingportion 80 is provided at the top and bottom of the mounting portion 71of the lead frame 70, as shown in FIG. 9. Accordingly, in the fifthembodiment, as shown in FIG. 10, a second sheet-shaped resin portion 84is arranged at a side of the mounting portion 71 opposite to thesemiconductor chip 74 and the resin sealing portion 80 seals thesheet-shaped resin portion 82 and the second sheet-shaped resin portion84, in addition to the configuration employed in the fourth embodiment.This will make it possible to prevent the generation of theresin-unfilled portion, even if the resin sealing portion 80 provided ata side of the mounting portion 71 opposite to the semiconductor chip 74.In accordance with the fourth and fifth embodiments, it is possible toprevent the generation of the filler removed portion, if no filler isadded to the sheet-shaped resin portion 82 or the second sheet-shapedresin portion 84.

Sixth Embodiment

In a sixth embodiment, a conductive sheet 86 is provided at a side ofthe sheet-shaped resin portion 82 opposite to the semiconductor chip 74,in addition to the semiconductor device employed in the fourthembodiment, as shown in FIG. 11. Also, a conductive sheet 36 is providedat a side of the sheet-shaped resin portion 32 c opposite to thesemiconductor chip 24, in addition to the semiconductor device employedin the third embodiment, as shown in FIG. 12. The conductive sheets 86and 36 may have a configuration in which a wiring is embedded, forexample, in a metal sheet or an insulating film. An example of theconfiguration includes a copper wiring embedded in a glass epoxy resin.Electromagnetic waves can be shielded by providing the conductive sheets86 and 36. This can suppress the radio interference. Also, theconductive sheets 86 and 36 serve as heat sinks. In addition, it ispossible to suppress the warp of the package. Furthermore, it ispossible to prevent the damage applied to the semiconductor chips 74 and24 at the time of printing a mark by means of laser.

In addition to the thermosetting epoxy resin, for example, thermosetpolyimide resin, maleimide resin, silicone resin, phenol resin,polyurethane resin, or acrylic resin may be used for sheet-shaped resinportions 32, 82, and 84 and the resin sealing portions 30 and 80. Inaddition to the wiring substrate 10 having a wiring pattern in theinsulating substrate and the lead frame 70 made of a metal material, amember that can mount the semiconductor chip thereon may be used for thechip mounting portion. The sheet-shaped resin portions 32 a through 32 care examples in which no filler is included, however, the filler may beadded.

Embodiments generally relate to semiconductor devices. Moreparticularly, embodiments allow for smaller semiconductor devices. Inone implementation, the various embodiments are applicable to flashmemory and devices that utilize flash memory. Flash memory is a form ofnon-volatile memory that can be electrically erased and reprogrammed. Assuch, flash memory, in general, is a type of electrically erasableprogrammable read only memory (EEPROM).

Like Electrically Erasable Programmable Read Only Memory (EEPROM), flashmemory is nonvolatile and thus can maintain its contents even withoutpower. However, flash memory is not standard EEPROM. Standard EEPROMsare differentiated from flash memory because they can be erased andreprogrammed on an individual byte or word basis while flash memory canbe programmed on a byte or word basis, but is generally erased on ablock basis. Although standard EEPROMs may appear to be more versatile,their functionality requires two transistors to hold one bit of data. Incontrast, flash memory requires only one transistor to hold one bit ofdata, which results in a lower cost per bit. As flash memory costs farless than EEPROM, it has become the dominant technology wherever asignificant amount of non-volatile, solid-state storage is needed.

Exemplary applications of flash memory include digital audio players,digital cameras, digital video recorders, and mobile phones. Flashmemory is also used in USB flash drives, which are used for generalstorage and transfer of data between computers. Also, flash memory isgaining popularity in the gaming market, where low-cost fast-loadingmemory in the order of a few hundred megabytes is required, such as ingame cartridges. Additionally, flash memory is applicable to cellularhandsets, smartphones, personal digital assistants, set-top boxes,digital video recorders, networking and telecommunication equipments,printers, computer peripherals, automotive nagivation devices, andgaming systems.

As flash memory is a type of non-volatile memory, it does not need powerto maintain the information stored in the chip. In addition, flashmemory offers fast read access times and better shock resistance thantraditional hard disks. These characteristics explain the popularity offlash memory for applications such as storage on battery-powered devices(e.g., cellular phones, mobile phones, IP phones, wireless phones,etc.).

Flash memory stores information in an array of floating gatetransistors, called “cells”, each of which traditionally stores one bitof information. However, newer flash memory devices, such as MirrorBit®Flash Technology from Spansion Inc., can store more than 1 bit per cell.The MirrorBit cell doubles the intrinsic density of a Flash memory arrayby storing two physically distinct bits on opposite sides of a memorycell. Each bit serves as a binary bit of data (e.g., either 1 or 0) thatis mapped directly to the memory array. Reading or programming one sideof a memory cell occurs independently of whatever data is stored on theopposite side of the cell.

With regards to wireless markets, flash memory that utilizes MirrorBitetechnology has several key advantages. For example, flash memory thatutilizes MirrorBit® technology is capable of burst-mode access as fastas 80 MHz, page access times as fast as 25 ns, simultaneous read-writeoperation for combined code and data storage, and low standby power(e.g., 1 μA).

FIG. 13 shows a block diagram of a conventional portable telephone 2010(e.g., cell phone, cellular phone, mobile phone, internet protocolphone, wireless phone, etc.), upon which embodiments can be implemented.The cell phone 2010 includes an antenna 2012 coupled to a transmitter2014 and a receiver 2016, as well as a microphone 2018, a speaker 2020,a keypad 2022, and a display 2024. The cell phone 2010 also includes apower supply 2026 and a central processing unit (CPU) 2028, which may bean embedded controller, conventional microprocessor, or the like. Inaddition, the cell phone 2010 includes integrated, flash memory 2030.Flash memory 2030 includes a semiconductor chip, a chip mounting portionmounting the semiconductor chip, a sheet-shaped resin portion providedat a side of the semiconductor chip opposite to the chip mountingportion, and a resin sealing portion provided between the sheet-shapedresin and the chip mounting portion, to seal the semiconductor chip.According to various embodiments, it is possible to provide asemiconductor device, such as flash memory, which has a reduced packagesize and does not include an unfilled portion in a resin sealing portionor a filler-removed portion or does not have an exposed wire from theresin sealing portion. The present invention also provides a method ofmanufacturing such a semiconductor device. As a result, the flash memory2030 is able to be manufactured in a much smaller package than previous.This decreased size for the flash memory translates into decreased sizefor various devices, such as mobile phones, cellular phones, internetprotocol phones, and/or wireless phones.

Flash memory comes in two primary varieties, NOR-type flash andNAND-type flash. While the general memory storage transistor is the samefor all flash memory, it is the interconnection of the memory cells thatdifferentiates the designs. In a conventional NOR-type flash memory, thememory cell transistors are connected to the bit lines in a parallelconfiguration, while in a conventional NAND-type flash memory, thememory cell transistors are connected to the bit lines in series. Forthis reason, NOR-type flash is sometimes referred to as “parallel flash”and NAND-type flash is referred to as “serial flash.”

Traditionally, portable phone (e.g., cell phone) CPUs have needed only asmall amount of integrated NOR-type flash memory to operate. However, asportable phones (e.g., cell phone) have become more complex, offeringmore features and more services (e.g., voice service, text messaging,camera, ring tones, email, multimedia, mobile TV, MP3, location,productivity software, multiplayer games, calendar, and maps.), flashmemory requirements have steadily increased. Thus, a less expensiveflash memory will render a portable phone more competitive in thetelecommunications market.

Also, as mentioned above, flash memory is applicable to a variety ofdevices other than portable phones. For instance, flash memory can beutilized in personal digital assistants, set-top boxes, digital videorecorders, networking and telecommunication equipments, printers,computer peripherals, automotive navigation devices, and gaming systems.

FIG. 14 illustrates a block diagram of a computing device 2100, uponwhich embodiments of the present invention can be implemented. Althoughcomputing device 2100 is shown and described in FIG. 14 as havingcertain numbers and types of elements, the embodiments are notnecessarily limited to the exemplary implementation. That is, computingdevice 2100 can include elements other than those shown, and can includemore than one of the elements that are shown. For example, computingdevice 2100 can include a greater number of processing units than theone (processing unit 2102) shown. Similarly, in another example,computing device 2100 can include additional components not shown inFIG. 14.

Also, it is appreciated that the computing device 2100 can be a varietyof things. For example, computing device 2100 may be, but is not limitedto, a personal desktop computer, a portable notebook computer, apersonal digital assistant (PDA), and a gaming system. Flash memory isespecially useful with small-form-factor computing devices such as PDAsand portable gaming devices. Flash memory offers several advantages. Inone example, flash memory is able to offer fast read access times whileat the same time being able to withstand shocks and bumps better thanstandard hard disks. This is important as small computing devices areoften moved around and encounter frequent physical impacts. Also, flashmemory is more able than other types of memory to withstand intensephysical pressure and/or heat. Thus, portable computing devices are ableto be used in a greater range of environmental variables.

In its most basic configuration, computing device 2100 typicallyincludes at least one processing unit 2102 and memory 2104. Depending onthe exact configuration and type of computing device, memory 2104 may bevolatile (such as RAM), non-volatile (such as ROM, flash memory, etc.)or some combination of the two. This most basic configuration ofcomputing device 2100 is illustrated in FIG. 11 by line 2106.Additionally, device 2100 may also have additionalfeatures/functionality. For example, device 2100 may also includeadditional storage (removable and/or non-removable) including, but notlimited to, magnetic or optical disks or tape. In one example, in thecontext of a gaming system, the removable storage could a game cartridgereceiving component utilized to receive different game cartridges. Inanother example, in the context of a Digital Versatile Disc (DVD)recorder, the removable storage is a DVD receiving component utilized toreceive and read DVDs. Such additional storage is illustrated in FIG. 14by removable storage 2108 and non-removable storage 2110. Computerstorage media includes volatile and nonvolatile, removable andnon-removable media implemented in any method or technology for storageof information such as computer readable instructions, data structures,program modules or other data. Memory 2104, removable storage 2108 andnon-removable storage 2110 are all examples of computer storage media.Computer storage media includes, but is not limited to, RAM, ROM,EEPROM, flash memory 2120 or other memory technology, CD-ROM, digitalvideo disks (DVD) or other optical storage, magnetic cassettes, magnetictape, magnetic disk storage or other magnetic storage devices, or anyother medium which can be used to store the desired information andwhich can accessed by device 2100. Any such computer storage media maybe part of device 2100.

In the present embodiment, the flash memory 2120 comprises: asemiconductor chip, a chip mounting portion mounting the semiconductorchip, a sheet-shaped resin portion provided at a side of thesemiconductor chip opposite to the chip mounting portion, and a resinsealing portion provided between the sheet-shaped resin and the chipmounting portion, to seal the semiconductor chip. According to variousembodiments, it is possible to provide a semiconductor device, such asflash memory, which has a reduced package size and does not include anunfilled portion in a resin sealing portion or a filler-removed portionor does not have an exposed wire from the resin sealing portion. Thepresent invention also provides a method of manufacturing such asemiconductor device. As a result, the flash memory 2030 is able to bemanufactured in a much smaller package than previous. This decreasedsize for the flash memory translates into decreased size for variousdevices, such as personal digital assistants, set-top boxes, digitalvideo recorders, networking and telecommunication equipments, printers,computer peripherals, automotive navigation devices, gaming systems,mobile phones, cellular phones, internet protocol phones, and/orwireless phones. Further, in one embodiment, the flash memory 2120utilizes MirrorBit® technology to allow storing of two physicallydistinct bits on opposite sides of a memory cell.

Device 2100 may also contain communications connection(s) 2112 thatallow the device to communicate with other devices. Communicationsconnection(s) 2112 is an example of communication media. Communicationmedia typically embodies computer readable instructions, datastructures, program modules or other data in a modulated data signalsuch as a carrier wave or other transport mechanism and includes anyinformation delivery media. The term “modulated data signal” means asignal that has one or more of its characteristics set or changed insuch a manner as to encode information in the signal. By way of example,and not limitation, communication media includes wired media such as awired network or direct-wired connection, and wireless media such asacoustic, RF, infrared and other wireless media. The term computerreadable media as used herein includes both storage media andcommunication media.

Device 2100 may also have input device(s) 2114 such as keyboard, mouse,pen, voice input device, game input device (e.g., a joy stick, a gamecontrol pad, and/or other types of game input device), touch inputdevice, etc. Output device(s) 2116 such as a display (e.g., a computermonitor and/or a projection system), speakers, printer, networkperipherals, etc., may also be included. All these devices are wellknown in the art and need not be discussed at length here.

Aside from mobile phones and portable computing devices, flash memory isalso widely used in portable multimedia devices, such as portable musicplayers. As users would desire a portable multimedia device to have aslarge a storage capacity as possible, an increase in memory densitywould be advantageous. Users would also benefit from reduced memory readtime and reduced cost.

FIG. 15 shows an exemplary portable multimedia device, or media player,3100 in accordance with an embodiment of the invention. The media player3100 includes a processor 3102 that pertains to a microprocessor orcontroller for controlling the overall operation of the media player3100. The media player 3100 stores media data pertaining to media assetsin a file system 3104 and a cache 3106. The file system 3104 is,typically, a storage medium or a plurality of storage media, such asdisks, memory cells, and the like. The file system 3104 typicallyprovides high capacity storage capability for the media player 3100.Also, file system 3104 includes flash memory 3130. In the presentembodiment, the flash memory 3130 comprises: a semiconductor chip, achip mounting portion mounting the semiconductor chip, a sheet-shapedresin portion provided at a side of the semiconductor chip opposite tothe chip mounting portion, and a resin sealing portion provided betweenthe sheet-shaped resin and the chip mounting portion, to seal thesemiconductor chip. According to various embodiments, it is possible toprovide a semiconductor device, such as flash memory, which has areduced package size and does not include an unfilled portion in a resinsealing portion or a filler-removed portion or does not have an exposedwire from the resin sealing portion. The present invention also providesa method of manufacturing such a semiconductor device. As a result, theflash memory 2030 is able to be manufactured in a much smaller packagethan previous. This decreased size for the flash memory translates intodecreased size for various devices, such as personal digital assistants,set-top boxes, digital video recorders, networking and telecommunicationequipments, printers, computer peripherals, automotive navigationdevices, gaming systems, mobile phones, cellular phones, internetprotocol phones, and/or wireless phones. However, since the access timeto the file system 3104 is relatively slow, the media player 3100 canalso include a cache 3106. The cache 3106 is, for example, Random-AccessMemory (RAM) provided by semiconductor memory. The relative access timeto the cache 3106 is substantially shorter than for the file system3104. However, the cache 3106 does not have the large storage capacityof the file system 3104. Further, the file system 3104, when active,consumes more power than does the cache 3106. The power consumption isparticularly important when the media player 3100 is a portable mediaplayer that is powered by a battery (not shown). The media player 3100also includes a RAM 3122 and a Read-Only Memory (ROM) 3120. The ROM 3120can store programs, utilities or processes to be executed in anon-volatile manner. The RAM 3122 provides volatile data storage, suchas for the cache 3106.

The media player 3100 also includes a user input device 3108 that allowsa user of the media player 3100 to interact with the media player 3100.For example, the user input device 3108 can take a variety of forms,such as a button, keypad, dial, etc. Still further, the media player3100 includes a display 3110 (screen display) that can be controlled bythe processor 3102 to display information to the user. A data bus 3124can facilitate data transfer between at least the file system 3104, thecache 3106, the processor 3102, and the CODEC 3112. The media player3100 also includes a bus interface 3116 that couples to a data link3118. The data link 3118 allows the media player 3100 to couple to ahost computer.

In one embodiment, the media player 3100 serves to store a plurality ofmedia assets (e.g., songs, photos, video, etc.) in the file system 3104.When a user desires to have the media player play/display a particularmedia item, a list of available media assets is displayed on the display3110. Then, using the user input device 3108, a user can select one ofthe available media assets. The processor 3102, upon receiving aselection of a particular media item, supplies the media data (e.g.,audio file, graphic file, video file, etc.) for the particular mediaitem to a coder/decoder (CODEC) 3110. The CODEC 3110 then producesanalog output signals for a speaker 3114 or a display 3110. The speaker3114 can be a speaker internal to the media player 3100 or external tothe media player 3100. For example, headphones or earphones that connectto the media player 3100 would be considered an external speaker.

In a particular embodiment, the available media assets are arranged in ahierarchical manner based upon a selected number and type of groupingsappropriate to the available media assets. For example, in the casewhere the media player 3100 is an MP3-type media player, the availablemedia assets take the form of MP3 files (each of which corresponds to adigitally encoded song or other audio rendition) stored at least in partin the file system 3104. The available media assets (or in this case,songs) can be grouped in any manner deemed appropriate. In onearrangement, the songs can be arranged hierarchically as a list of musicgenres at a first level, a list of artists associated with each genre ata second level, a list of albums for each artist listed in the secondlevel at a third level, while at a fourth level a list of songs for eachalbum listed in the third level, and so on.

Finally, various aspects of the present invention are summarized in thefollowing.

According to a first aspect of the present invention, there is provideda method for fabricating a semiconductor device including: mounting asemiconductor chip on a chip mounting portion; disposing a sheet-shapedresin at an opposite side of the semiconductor chip with respect to thechip mounting portion; and forming a resin sealing portion between thesheet-shaped resin and the chip mounting portion, to seal thesemiconductor chip.

In the above-described method, disposing the sheet-shaped resin mayinclude disposing the sheet-shaped resin on a surface of a die to sealthe semiconductor chip, the surface opposing the semiconductor chip. Itis possible to form a seat resin portion at a surface of thesemiconductor chip.

In the above-described method, forming the resin sealing portion mayinclude: disposing an uncured resin between the sheet-shaped resin andthe semiconductor chip; and sealing the semiconductor chip by theuncured resin. It is possible to further prevent the generation of aresin-unfilled portion

In the above-described method, forming the resin sealing portion may beforming the resin sealing portion by transfer molding. It is possible toprevent the generation of the resin-unfilled portion, even with theforming method of the resin sealing portion with the use of the transfermolding that may generate the resin-unfilled portion.

In the above-described method, the sheet-shaped resin may not include afiller. It is possible to prevent the generation of the filler-removedportion.

In the above-described method, forming the resin sealing portion mayinclude partially forming the resin sealing portion between thesheet-shaped resin and the semiconductor chip. It is possible to furtherprevent the generation of the resin-unfilled portion.

In the above-described method, disposing the sheet-shaped resin may bedisposing the sheet-shaped resin in contact with the semiconductor chip.With this configuration, it is possible to further prevent thegeneration of the resin-unfilled portion.

In the above-described method, the semiconductor chip may have stackedsemiconductor chips. It is possible to downsize the package of thestacked semiconductor chips, although it is difficult to thin thepackage thereof.

According to a second aspect of the present invention, there is provideda semiconductor device including: a semiconductor chip; a chip mountingportion mounting the semiconductor chip; a sheet-shaped resin portionprovided at an opposite side of the semiconductor chip with respect tothe chip mounting portion; and a resin sealing portion provided betweenthe sheet-shaped resin and the chip mounting portion, to seal thesemiconductor chip. It is possible to prevent the generation of theresin-unfilled portion.

In the above-described device, the sheet-shaped resin may not include afiller. It is possible to prevent the generation of the filler-removedportion in the resin portion.

In the above-described device, the resin sealing portion may bepartially provided between the sheet-shaped resin portion and thesemiconductor chip. It is possible to further prevent the generation ofthe resin-unfilled portion.

In the above-described device, the sheet-shaped resin portion may beprovided in contact with the semiconductor chip. It is possible tofurther prevent the generation of the resin-unfilled portion.

The above-described device may further include a wire connected betweenthe semiconductor chip and the chip mounting portion, and the wire maybe provided in contact with the sheet-shaped resin portion. It ispossible to prevent the exposure of the wire from the resin portion.

The above-described device may further include a wire connected betweenthe semiconductor chip and the chip mounting portion, and the wire maybe partially embedded in the sheet-shaped resin portion. It is possibleto further prevent the generation of the resin-unfilled portion.

The above-described device may further include a second sheet-shapedresin portion at an opposite side of the chip mounting portion withrespect to the semiconductor chip, and the resin sealing portion may beprovided between the sheet-shaped resin portion and the secondsheet-shaped resin portion. It is possible to prevent the generation ofthe resin-unfilled portion, even when the resin sealing portions areprovided at both sides of the chip mounting portion and the resinsealing portion at the side where the semiconductor chip is not mounted,is made thin.

The above-described device may further include a conductive sheetprovided at an opposite side of the sheet-shaped resin with respect tothe semiconductor chip. It is possible to prevent a damage caused byradio interference, warp of the package, printing a mark by means oflaser.

In the above-described device, the semiconductor chip may have stackedsemiconductor chips. It is possible to downsize the package of thestacked semiconductor chips, although it is difficult to thin thepackage thereof.

It is possible to provide a semiconductor device and a fabricationmethod therefor, by which it is possible to reduce the size of thepackage and to prevent the generation of an unfilled portion in a resinsealing portion or a filler removed portion or to prevent the exposureof wire from the resin sealing portion.

Although a few preferred embodiments of the present invention have beenshown and described, it would be appreciated by those skilled in the artthat changes may be made in these embodiments without departing from theprinciples and spirit of the invention, the scope of which is defined inthe claims and their equivalents.

1. A method for fabricating a semiconductor device comprising: mountinga semiconductor chip on a chip mounting portion; disposing asheet-shaped resin at a side of the semiconductor chip opposite to thechip mounting portion; and forming a resin sealing portion between thesheet-shaped resin and the chip mounting portion, to seal thesemiconductor chip.
 2. The method as claimed in claim 1, whereindisposing the sheet-shaped resin includes disposing the sheet-shapedresin on a surface of a die to seal the semiconductor chip, the surfaceopposing the semiconductor chip.
 3. The method as claimed in claim 2,wherein forming the resin sealing portion includes: disposing an uncuredresin between the sheet-shaped resin and the semiconductor chip; andsealing the semiconductor chip by the uncured resin.
 4. The method asclaimed in clam 1, wherein forming the resin sealing portion is formingthe resin sealing portion by transfer molding.
 5. The method as claimedin clam 1, wherein the sheet-shaped resin does not include a filler. 6.The method as claimed in clam 1, wherein forming the resin sealingportion includes partially forming the resin sealing portion between thesheet-shaped resin and the semiconductor chip.
 7. The method as claimedin clam 1, wherein disposing the sheet-shaped resin is disposing thesheet-shaped resin in contact with the semiconductor chip.
 8. The methodas claimed in clam 1, wherein the semiconductor chip has stackedsemiconductor chips.
 9. A semiconductor device comprising: asemiconductor chip; a chip mounting portion mounting the semiconductorchip; a sheet-shaped resin portion provided at a side of thesemiconductor chip opposite to the chip mounting portion; and a resinsealing portion provided between the sheet-shaped resin and the chipmounting portion, to seal the semiconductor chip.
 10. The semiconductordevice as claimed in claim 9, wherein the sheet-shaped resin does notinclude a filler.
 11. The semiconductor device as claimed in claim 9,wherein the resin sealing portion is partially provided between thesheet-shaped resin portion and the semiconductor chip.
 12. Thesemiconductor device as claimed in claim 9, wherein the sheet-shapedresin portion is provided in contact with the semiconductor chip. 13.The semiconductor device as claimed in claim 9 further comprising: awire connected between the semiconductor chip and the chip mountingportion, wherein the wire is provided in contact with the sheet-shapedresin portion.
 14. The semiconductor device as claimed in claim 9further comprising: a wire connected between the semiconductor chip andthe chip mounting portion, wherein the wire is partially embedded in thesheet-shaped resin portion.
 15. The semiconductor device as claimed inclaim 9 further comprising: a second sheet-shaped resin portion at aside of the chip mounting portion opposite to the semiconductor chip,wherein the resin sealing portion is provided between the sheet-shapedresin portion and the second sheet-shaped resin portion.
 16. Thesemiconductor device as claimed in claim 9, further comprising: aconductive sheet provided at a side of the sheet-shaped resin oppositeto the semiconductor chip.
 17. The semiconductor chip as claimed inclaim 9, wherein the semiconductor chip has stacked semiconductor chips.18. A wireless communications device, comprising: a memory comprising: asemiconductor chip; a chip mounting portion mounting the semiconductorchip; a sheet-shaped resin portion provided at a side of thesemiconductor chip opposite to the chip mounting portion; and a resinsealing portion provided between the sheet-shaped resin and the chipmounting portion, to seal the semiconductor chip; a processor; acommunications component; a transmitter; a receiver; and an antennaconnected to the transmitter circuit and the receiver circuit.
 19. Thewireless communications device of claim 18, wherein said flash memory isNAND flash memory.
 20. The wireless communications device of claim 18,wherein said flash memory is NOR flash memory.
 21. The wirelesscommunications device of claim 18, wherein said flash memory comprisesat least one memory cell operable to store more than one bit.
 22. Acomputing device comprising: a processor; an input component; an outputcomponent; a memory comprising: a semiconductor chip; a chip mountingportion mounting the semiconductor chip; a sheet-shaped resin portionprovided at a side of the semiconductor chip opposite to the chipmounting portion; and a resin sealing portion provided between thesheet-shaped resin and the chip mounting portion, to seal thesemiconductor chip.
 23. The computing device of claim 22, wherein saidcomputing device is a personal computer (PC).
 24. The computing deviceof claim 22, wherein said computing device is a personal digitalassistant (PDA).
 25. The computing device of claim 22, wherein saidcomputing device is a gaming system.
 26. A portable media playercomprising: a processor; a cache; a user input component; acoder-decoder component; and a memory comprising: a semiconductor chip;a chip mounting portion mounting the semiconductor chip; a sheet-shapedresin portion provided at a side of the semiconductor chip opposite tothe chip mounting portion; and a resin sealing portion provided betweenthe sheet-shaped resin and the chip mounting portion, to seal thesemiconductor chip.
 27. The portable media player of claim 26, whereinsaid portable media player is a portable music player.
 28. The portablemedia player of claim 26, wherein said portable media player is aportable video player.